Since its establishment in 2008, the company has provided MID connector products tailored to customer requirements for 237 clients. It has filed over 20 patents and achieved LDS process capabilities with 0.1MM line width and spacing,LAP process with 0.2MM linewidth and line spacing for mass production, nickel-plated surface solderable process, subtractive process, and nickel-palladium-gold process for mass production
For more than 16 years, we have continuously improved our processes, adhered to independent research and development, and made breakthroughs in material, performance, and process technology innovation. We have successfully solved the problem of complex structure metallization, reduced costs through technological improvements, and improved product performance. We have been awarded the titles of specialized and innovative enterprise, high-tech enterprise, and have 20 invention patents.
