What is 3D-MID

        3D-MID is an abbreviation for "Three dimensional molded interconnect devices or electronic assemblies" in English, which literally means three-dimensional molded interconnect devices or electronic components.

        3D-MID technology refers to a new industrial production technology that produces electrical functional wires and graphics, as well as electronic components (laser SMT welding), on the surface of injection molded plastic shells, mainly including dual-mode injection molding and laser laser molding. Thus, the electrical interconnection function, supporting component function, and plastic shell support, protection function of ordinary circuit boards, as well as the shielding, antenna and other functions generated by the combination of mechanical entities and conductive graphics, are integrated into one, forming the so-called three-dimensional molded interconnection device.

       3D-MID is a patented technology promoted and owned by the German company LPKF. It is currently widely used in wireless communication, medical devices, automotive electronics, computers, aerospace, electromechanical equipment, LED lighting, RFID and other fields, with more application areas being developed.

3D-MID (Molded Interconnected Devices) mainly consists of the following steps

LDS After the plastic is injection molded in step 2, it can be processed by laser in step 3. The material has a wavelength of 1064 nm of IR Laser light, when irradiated in a patterned manner, breaks the bond between the polymer and metal complex in the irradiated area (as shown on the left in the figure below), exposing the metal element (Cu).

Step 1: The production method is shown in the following figure. During the mixing process, the metal complex will combine with the polymer (plastic) to form a new one LDS(Laser Direct Structure) plastic

Step 4: Utilize exposed metal elements to catalyze subsequent chemical copper reactions, resulting in copper deposition in the laser activated area. The right side of the figure shows a comparison between the laser and non laser areas. The roughness of the laser area can ensure good adhesion of the metal layer.