Reduction method process:

        The subtractive process is a process that achieves selective metal coating by laser roughening of ordinary substrates and special chemical plating treatment; Compared to LDS material, the cost of ordinary plastic material is reduced, and the cost of chemical plating process is increased. The main process flow is as follows：

        With the development of technology, product miniaturization, lightweighting, and the diversification of product materials, the material surface can be cleaned or mechanically roughened, chemically roughened, activated pre plated with metal or vacuum plated according to product needs, and laser cutting can be used to create patterns or lines Selective electroplating of the circuit graphic area Remove pre plated metal (silver, tin, nickel gold, etc.) from non circuit diagram row areas to meet product functional requirements

     PC semiconductor carrier               PPS 5G base station oscillator           LCP connector housing metallization   PPO vehicle positioning and surveying antenna

Printing silver paste electroplating process：

        Print the required circuit graphics and patterns on the surface of PET or PI materials as needed, and after baking and curing, deposit a chemical copper layer or other metal on the surface of the printed graphics or circuits to meet the functional requirements of the product

Blackening process of camera module：

        In existing technology, metal plates are installed at cameras such as mobile phones, and black film is sprayed on the metal plates to achieve reflective or extinction effects. However, there may be uneven spraying when spraying black film, or over time, the sprayed black film may peel off, both of which can affect the shooting effect.

        After the blackening process, a uniform black film is formed on the surface of the metal workpiece after processing, and the black plating method is used to make the black film more stable on the surface of the metal workpiece, improving the product quality of the metal workpiece and avoiding the impact on the shooting effect. Process step one: degreasing the pre treated metal workpiece;  

Step 2: After degreasing, the metal workpiece is washed with water and then placed in an acid pickling solution for acid pickling;  

Step 3: Perform a water washing process on the processed metal workpiece again; 

Step 4: Place the metal workpiece into a blackening agent for surface blackening treatment. The blackening treatment time is 15-25 minutes and the temperature is 90-110 ℃;  

Step 5: The processed metal workpiece is first subjected to a water washing process, followed by a soup washing process;

Step 6: Perform a dehydration process on the metal workpiece until there is no residual moisture on the metal workpiece

Chemical nickel plating process:

        Chemical nickel plating is an advanced surface treatment process that uses non electroplating (chemical) methods to deposit a very uniform, bright, and hard nickel phosphorus boron alloy coating on the surface of components. It has six advantages: high uniformity, high bonding strength, high wear resistance, high corrosion resistance, no plating defects, and excellent simulation performance. Its comprehensive performance is superior to chrome plating.

        In many environmental media, it is even more corrosion-resistant than stainless steel, and replacing stainless steel can reduce the cost of workpieces.In terms of process, electroless nickel plating is formed by chemical methods to form a coating, which is not limited by the shape and size of the part. The coating thickness of each part of any complex shaped part is uniform and consistent. The thickness accuracy during the plating process is ± 2 μ m, which can meet the size requirements of various complex and precise components. Moreover, the nickel alloy coating is dense and smooth, and does not require any processing after plating, and can be repeatedly repaired. This technology is a new surface treatment technology that is currently being promoted as a key focus in developed countries.